Research, commentary, and field notes from Coexin's investment team. No sponsored content, no marketing copy.
The AI hardware debate obsesses over GPU compute and memory bandwidth. Meanwhile, the interconnect layer — the part that moves data between chips — is where the real constraint lives.
Read MoreSurface codes look clean on a whiteboard. Getting them to work on actual hardware — with real decoherence times and crosstalk — is a different problem entirely. Here's what the benchmarks don't tell you.
Read MoreThe question is no longer whether RISC-V can compete — it's which companies will own the EDA stack and the toolchain that makes RISC-V custom silicon practical for volume production.
Read MoreIntel and TSMC are betting on 3D stacking to extend Moore's Law. The 2D materials community thinks the answer is a different channel material altogether. The evidence is more interesting than the headlines suggest.
Read MoreSemiconductor yields are still partly determined by human judgment calls made at 3am. Autonomous process control isn't just an efficiency play — it's how the industry gets to consistent sub-2nm volume production.
Read MoreQKD deployments have been running on dark fiber for two years in Asia and Europe. The US government just noticed. Here's what the infrastructure buildout looks like and who the buyers actually are.
Read MoreThe transistor scaling roadmap has a materials bottleneck that gets almost no coverage outside of device physics conferences. Equivalent oxide thickness below 4 angstroms is not a lithography problem — it's a chemistry problem.
Read MoreSRAM is fast but power-hungry. DRAM is denser but too slow for in-memory compute. The neuromorphic community has been arguing for a decade that spin-transfer torque RAM is the answer. Here's where that bet stands.
Read MoreStandard venture fund economics were designed for software. The ten-year clock, the DPI expectations, the portfolio construction math — none of it maps cleanly onto companies building physical hardware at the device level.
Read MoreThe CHIPS Act, export controls, and allied nations' domestic fab investments have changed the investment calculus for semiconductor companies in ways that go beyond individual company risk profiles.
Read MoreCopper interconnects lose energy as heat. Photonic interconnects lose energy as light. The second number is smaller — and the gap grows wider as data rates climb past 400Gbps.
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